4Z03 Semiconductor Manufacturing Technology
Term II - 2011/2012
INSTRUCTOR:
Dr. Leyla Soleymani- ETB 407- (905) 525-9140 ext 27204- soleyml@mcmaster.ca
Office hours: Wednesdays 1:30 PM - 2:30 PM, ETB 407
TIMES:
Mondays 9:30-10:20 JHE 234- computer cluster-based lecture per week
Monday/Wednesday 11:30-12:20 ETB 230
TA:
Dixon Paez- paezcadj@mcmaster.ca
Office: ETB-529 or JHE-A312-Office hours: TBA
TEXT BOOK:
Avenue to Learn course shell
Compulsory Text book
"Silicon VLSI Technology", J D Plummer, M D Deal, and P B Griffin, Prentice-Hall, 2000
Reference Text books "Semiconductor Manufacturing Technology", Michael Quirk and Julian Serda, Prentice Hall, 2001; "ULSI Technology" C Y Chang and S M Sze, McGraw-Hill, 1996, www.Silivaco.com
COURSE OUTLINE:
The objective of this course is to give an introduction to the theory and technology of micro/nanofabrication. Two thirds of the course is lecture-based, where the theory of basic processing techniques from the formation of semiconductor wafer material to the finished device assembly will be discussed.
One third of the lectures will be based in a classroom PC cluster. State-of-the-art process simulators are used to virtually fabricate semiconductor chips and subsequently test their electronic properties.
At the end of the course one should have a good understanding of the various processing techniques used to micro/nano fabricate semiconductor devices; and to be able to simulate these processes using process simulators.
LECTURES:
Topics |
Text Chapters |
Introduction to the Semiconductor Technology |
Chap. 1 |
Properties of Semiconductor Materials |
Chap. 1 |
| Device Background | Chap. 1 |
| CMOS Technology | Chap. 2 |
| Crystal Growth and Wafer Fabrication | Chap. 3 |
| Cleanrooms | Chap. 4 |
| Lithography | Chap. 5 |
| Oxidation and annealing | Chap. 6 |
| Ion Implantation | Chap. 8 |
| Diffusion | Chap. 7 |
| Etching | Chap. 10 |
| Thin Film Deposition | Chap. 9 |
ASSESSMENT:
| Assignments | 10% |
| Midterm exam | 15% |
| Oral presentation | 15% |
| Silvaco modules | 20% |
| Final exam | 40% |
The instructor and university reserve the right to modify elements of the course during the term. The university may change the dates and deadlines for any or all courses in extreme circumstances. If either type of modification becomes necessary, reasonable notice and communication with the students will be given with explanation and the opportunity to comment on changes. It is the responsibility of the student to check their McMaster email and course websites weekly during the term and to note any changes.
POLICY REMINDERS:
Academic dishonesty consists of misrepresentation by deception or by other fraudulent means and can result in serious consequences, e.g. the grade of zero on an assignment, loss of credit with a notation on the transcript (notation reads: "Grade of F assigned for academic dishonesty"), and/or suspension or expulsion from the university.
It is your responsibility to understand what constitutes academic dishonesty. For information on the various kinds of academic dishonesty please refer to the Academic Integrity Policy, specifically Appendix 3, located at http://www.mcmaster.ca/senate/academic/ac_integrity.htm
The following illustrates only three forms of academic dishonesty:
1. Plagiarism, e.g. the submission of work that is not one's own or for which other credit has been obtained.
2. Improper collaboration in group work.
3. Copying or using unauthorized aids in tests and examinations.
The Faculty of Engineering is concerned with ensuring an environment that is free of all adverse discrimination. If there is a problem that cannot be resolved by discussion among the persons concerned, individuals are reminded that they should contact their Department Chair, the Sexual Harassment Officer or the Human Rights Consultant, as soon as possible.
